The conventional planar Metal-Oxide-Semiconductor FETs (MOSFETs) are being replaced with Fin Field-Effect Transistors (FinFETs) due to their improved ability to manage power dissipation, propagation delay, leakage current, and short channel effects. Process variability is an issue for planar MOSFETs, however the amount of dopant ions in FinFETs reduces device performance variability. In this study, a Static-Random Access Memory (SRAM) cell employing FinFET technology is designed using three MOS transistors. It is composed of two NMOS plus a single PMOS transistor. One NMOS acts as access transistor while the pull-up and pull-down functions are performed by remaining NMOS and PMOS transistors, respectively. The proposed SRAM cell is simulated using H-SPICE simulator and is compared with existing SRAM cell designs in terms delay, power consumption and transistor count. Performance analysis shows that the proposed SRAM Cell overcomes the constraint and achieves full swing storage of logic values between 0 and 1. This justifies the definition of static. Implementing a single-ended SRAM cell also has the benefit of simplifying the SRAM cell architecture, which also results in a reduction in area.