Development of Electroplating Setup for Plating Abs Plastics

Mithun V Kulkarni*, Elangovan K.**, K. Hemachandra Reddy***
* Research Scholar, JNTU College of Engineering, Anantapur, India.
** Associate Professor, Cambridge Institute of Technology, Bangalore, Karnataka, India.
*** Professor, Department of Mechanical Engineering, JNTU College of Engineering, Anantapur, Andhra Pradesh, India.
Periodicity:May - July'2012
DOI : https://doi.org/10.26634/jme.2.3.1871

Abstract

Over the recent years there has been an ever-increasing trend to replace metals with plastics in the manufacture of computers, business and industrial machines, automotive and telecommunication components and other electronic equipments. Usually a plastic component will be lighter in weight which in aerospace Industry especially always has been an important consideration. Weight savings have assumed greater importance in other market for example, motor vehicles, where a key factor in achieving greater fuel economy has been reduction in weight overall brought about by changes from metals to plastics, ABS chrome plated parts are one such example for weight reduction in automobile components. Plating on plastics therefore has been developed and widely concerned in manufacturing printed circuit boards, automobile parts, in the electromagnetic interference (EMI) shielding application, regulator knobs for fan cooler, push buttons, etc. After plating there is no apparent difference visually between metal and plastic parts. For electroplating, the plastic model needs to be made electrically conductive in order for the electroplating process to work, and in this paper an attempt has been made to show and understand the development of electroplating setup for plating ABS plastics.

Keywords

Electroplating, Electroless Plating, Copper, Nickel, Plastics, ABS.

How to Cite this Article?

Mithun V Kulkarni, Elangovan K and Hemachandra Reddy K (2012). Development Of Electroplating Setup For Plating ABS Plastics. i-manager’s Journal on Mechanical Engineering, 2(3), 53-58. https://doi.org/10.26634/jme.2.3.1871

References

[1]. Deckert, C.A. (1995). Electroless copper plating - a review. 1. Plat Surf Finish 82(2):48.
[2]. Deckert, C.A. (1995). Electroless copper plating - a review. 2. Plat Surf Finish 82(3):58.
[3]. Hudd A.B., Bentley P., Fox J., Robinson, M. (2006). Method of forming a conductive metal region on a substrate. US Patent 20060134318 (pending).
[4]. Kuzmik, J.J. (1990). In: Mallory GO, Hajdu JB (eds) Electroless plating: fundamentals and applications (Reprint Edition). The American Electroplaters and Surface Finishers Society, pp 377–399.
[5]. Lowenheim, F.A. (1997). Electroplating; State Mutual Book & Periodical Service: New York.
[6]. Radovsky, D.A., Ronkese B.J. et al., (1963). Method of electroplating on a dielectric base. US patent 3,099,608.
[7]. Viswanathan, B. (1993). Metallization of plastics by electroless plating. Curr Sci 65(7):537.
[8]. Weng, D.C., Landau, U. (1995). Direct electroplating on nonconductors. J Electrochem Soc ,142(8):2598.
If you have access to this article please login to view the article or kindly login to purchase the article

Purchase Instant Access

Single Article

North Americas,UK,
Middle East,Europe
India Rest of world
USD EUR INR USD-ROW
Pdf 35 35 200 20
Online 35 35 200 15
Pdf & Online 35 35 400 25

Options for accessing this content:
  • If you would like institutional access to this content, please recommend the title to your librarian.
    Library Recommendation Form
  • If you already have i-manager's user account: Login above and proceed to purchase the article.
  • New Users: Please register, then proceed to purchase the article.