Microdrilling of difficult to cut materials for MEMS applications using ultrasonic micromachining

Vivek Jain*, Apurbba Kumar Sharma**, Pradeep Kumar***
* Mechanical and Industrial Engineering Department, Roorkee, Uttarakhand, India.
** Assistant Professor, Mechanical and Industrial Engineering Department, I.I.T Roorkee, Roorkee, Uttarakhand, India.
*** Dean, Finance & Planning and Professor, Mechanical and Industrial Engineering Department, I.I.T Roorkee, Roorkee, Uttarakhand, India.
Periodicity:February - April'2011
DOI : https://doi.org/10.26634/jme.1.2.1404

Abstract

A comprehensive understanding of the materials and their processing helps efficient fabrication of component in micro devices such as microelectromechanical systems (MEMS). Silicon is one of the widely used materials to create many integrated circuits used in consumer electronics in the modern world. Glass and titanium are two other materials widely used in fabrication of MEMS which usually exhibit very high degree of reliability. However, one of the most challenging tasks for MEMS industries is to find new methods for machining such difficult-to-process materials. This paper explores a non-thermal and non-chemical approach to machine these materials using ultrasonic micromachining (USMM). In the current work, microdrilling was carried out on silicon, glass and titanium using USMM. Machinablity aspects while drilling holes have been analysed in terms of study of surface roughness and tool wear. The process yielded a surface finish upto 2.08µm, while the highest tool wear among the attempted materials was observed while machining relatively ductile titanium.  The study proves the viability of micro drilling of the target materials with parametric analysis. A brief review of different materials used for MEMS, their suitability and processing challenges has been presented.

Keywords

MEMS, Advanced Materials, Ultrasonic Micromachining, Surface Characterisation.

How to Cite this Article?

Vivek Jain, A. K. Sharma and Pradeep Kumar (2011). Microdrilling Of Difficult To Cut Materials For MEMS Applications Using Ultrasonic Micromachining. i-manager’s Journal on Mechanical Engineering, 1(2), 24-32. https://doi.org/10.26634/jme.1.2.1404

References

[1]. Gad-El-Hak, M. (2006). MEMS: Applications. CRC Press, 2nd Edition.
[2]. Masuzawa, T. (2000). State of the Art of Micromachining. CIRP Annals - Manufacturing Technology, Vol. 49, Issue 2, 473-488.
[3]. Jain, V., Sharma, A.K., Kumar, P. (2011). Recent Developments and Research Issues in Microultrasonic Machining. International Scholarly Research Network, ISRN Mechanical Engineering, Volume 2011, 1-15.
[4]. Sun, X.Q., Masuzawa, T., and Fujino, M. (1996).. Micro ultrasonic machining and its applications in MEMS. Sensors and Actuators, A: Physical, 57 (2), 159-164.
[5]. James M. Bustillo, Roger T. Howe, Richard S. Muller (1998). Surface Micromachining for Microelectro Mechanical Systems. Proceedings of the IEEE, Vol. 86, No. 8, 1552-1574.
[6]. French, P.J., Gennissen, P.T.J., Sarro, P.M. (1997). New Silicon Micromachining Techniques for Microsystems. Sensors and actuators, A 62, 652-662.
[7]. Adams, A.C. (1988). Dielectric and Polysilicon Film Deposition. VLSI Technology, 2nd edition, McGraw-Hill, New York, 93–129.
[8]. Rosler, R.S. (1977). Low Pressure CVD Production Processes for Poly Nitride, and Oxide. Solid State Technol. 20, 63–70.
[9]. Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang, Wei Chung Wang and Weileun Fang (2008). Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration. Journal of Micromechanics and Microengineering, 18, 1-6.
[10]. Liu, R., Vasile, M.J., and Beebe, D.J. (1999). The Fabrication of Nonplanar Spin-On Glass Microstructures. MEMS 8, 146–51.
[11]. Mahadevan, R.,Mehregany, M., and Gabriel, K.J. (1990). Application of Electric Microactuators to Silicon Micromechanics. Sensor and actuator. A 21–23, 219–25.
[12]. Shari Farrens (2008). Latest Metal Technologies for 3D Integration and MEMS Wafer Level Bonding. SUSS MicroTec Inc.
[13]. Chen, L.Y. and MacDonald, N. (1991). A Selective CVD Tungsten Process for Micromotors. in Technical Digest: 6th Int. Conf. on Solid-State Sensors and Actuators, 739–42.
[14]. Parker, E. R., Thibeault, B. J., Aimi, M. F., Rao, M. P. and MacDonald, N. C. (2005). Inductively coupled Plasma Etching of Bulk Titanium for MEMS Applications. Journal of the electrochemical Society, 152 (10), C675-C683.
[15]. Egashira, K., Masuzawa, T., Fujino, M. and Sun, X. Q (1997). Application of USM to Micromachining by On-the-machine Tool Fabrication. International Journal of Electrical Machining, No. 2, 31-36.
[16]. Komaraiah, M. and Narasimha Reddy, P. (1993). A study on the influence of work piece properties in ultrasonic machining. International Journal of Machine Tools and Manufacture, Volume 33, Issue 3, 495-505.
[17]. Singh, Rupinder and Khamba, J.S. (2006). Ultrasonic machining of titanium and its alloys: A review. Journal of Materials Processing Technology, 173, 125–135.
[18]. Instruction manual for stationary SONIC-MILL 500W Model 2002 (U.S.A).
[19]. Benedict Gary, F. (1987). Book on Non Traditional Manufacturing Processes. Marcel Dekker, Inc, New York, 67–86 [Chapter 6].
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