Investigate Sub-Threshold Performance Measures of Cylindrical Gate All Around MOSFET at Sub-Nanometer Regime

Tarun Kumar Sachdeva*, S. K. Aggarwal**, Alok K. Kushwaha***
* Research Scholar, Department of Electrical and Electronics Engineering, YMCAUST, Faridabad, India.
** Professor, Department of Electrical and Electronics Engineering, YMCAUST, Faridabad, India.
*** Professor and Assistant Dean (Academic), Waljat College of Applied Science, Muscat, Oman.
Periodicity:July - December'2017
DOI : https://doi.org/10.26634/jes.6.1.13889

Abstract

This paper investigates the effect of the work function on 45 nm gate length, cylindrical gate all around MOSFET and evaluates the short channel performance of the device using gate electrode work function analysis. In this work, the sensitivity of gate work function (φM) on various performance metrics like threshold voltage (Vt ), On current (ION ), subthreshold leakage current (IOFF ), On-Off current ratio (ION /IOFF ), Subthreshold slope and DIBL (Drain Induced Barrier Lowering) of cylindrical GAA are systematically evaluated and analysed. The SCE (Short Channel Effects) can sensibly be controlled and improved by proper adjustment of the metal gate work-function. In the present study, all the device performances are investigated through ATLAS device simulator from Silvaco.

Keywords

CGAA, DIBL, SCE, SOI, MOSFET

How to Cite this Article?

Sachdeva, T, K., Aggarwal, S. K., and Kushwaha, A. K. (2017). Investigate Sub-Threshold Performance Measures of Cylindrical Gate All Around MOSFET at Sub-Nanometer Regime. i-manager's Journal on Embedded Systems, 6(1), 1-5. https://doi.org/10.26634/jes.6.1.13889

References

[1]. Ana, F. (2011). Gate Workfunction Engineering for Deep Sub-Micron MOSFET's: Motivation, Features and Challenges. IJECT, 2(4).
[2]. Bangsaruntip, S., Cohen, G. M., Majumdar, A., & Sleight, J. W. (2010). Universality of short-channel effects in undoped-body silicon nanowire MOSFETs. IEEE Electron Device Letters, 31(9), 903-905.
[3]. Chang, L., Tang, S., King, T. J., Bokor, J., & Hu, C. (2000). Gate length scaling and threshold voltage control of double-gate MOSFETs. In Electron Devices Meeting, 2000. IEDM'00. Technical Digest. International (pp. 719-722). IEEE.
[4]. Chaudhry, A., & Kumar, M. J. (2004). Controlling shortchannel effects in deep-submicron SOI MOSFETs forimproved reliability: A review. IEEE Transactions on Device and Materials Reliability, 4(1), 99-109.
[5]. Chiang, T. K. (2011). A compact model for threshold voltage of surrounding-gate MOSFETs with localized interface trapped charges. IEEE Transactions on Electron Devices, 58(2), 567-571.
[6]. Chiang, T. K., & Liou, J. J. (2013). An analytical subthreshold current/swing model for junctionless cylindrical nanowire FETs (JLCNFETs). Facta Universitatisseries: Electronics and Energetics, 26(3), 157-173.
[7]. Mustafa, M., Bhat, T. A., & Beigh, M. R. (2013). Threshold voltage sensitivity to metal gate work-function based performance evaluation of double-gate n-FinFET structures for LSTP technology. World Journal of Nano Science and Engineering, 3(01), 17.
[8]. Pratap, Y., Ghosh, P., Haldar, S., Gupta, R. S., & Gupta, M. (2014). An analytical subthreshold current modeling of Cylindrical Gate All Around (CGAA) MOSFET incorporating the influence of device design engineering . Microelectronics Journal, 45(4), 408-415.
[9]. Siliconix, V. (2010). Measuring Power MOSFET Characteristics. Application Note AN-95.
[10]. Tsui, B. Y. & Huang, C. F. (2003). Wide range work function modulation of binar y alloys for MOSFET application. IEEE Electron Device Letters, 24(3), 153-155.
[11]. Young, K. K. (1989). Short-channel effect in fully depleted SOI MOSFETs. IEEE Transactions on Electron Devices, 36(2), 399-402.
[12]. Zhang, L., Ma, C., He, J., Lin, X., & Chan, M. (2010). Analytical solution of subthreshold channel potential of gate underlap cylindrical gate-all-around MOSFET. Solid- State Electronics, 54(8), 806-808.
[13]. Zhou, X., Lim, K. Y., & Lim, D. (1999). A simple and unambiguous definition of threshold voltage and its implications in deep-submicron MOS device modeling. IEEE Transactions on Electron Devices, 46(4), 807-809.
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