Electrically Conductive Adhesives (ECAs) are widely applied in electronic packaging such as solder less interconnections, heat dissipation and component repair. This research focuses on the effects of polyaniline filler percentage in the silver-polyaniline epoxy conductive adhesive. Conductive adhesives with different polyaniline filler concentrations were prepared, so as to check on how the different filler concentrations affect the shear strength of the ECAs. Silver concentration was kept constant, but the polyaniline concentration was varied between 3-10%. The shear strength of the adhesive was measured using the universal tensile machine and the results showed that, more the filler loading is increased, less the adhesive strength exhibited by the composite. The research also shows the synthesis of the main filler silver particles by chemical reduction method and also the synthesis of the co-filler polyaniline by chemical method and both UV (Ultraviolet) and SEM (Scanning Electron Microscope) characterizations were conducted.