JMS_V1_N1_RevP1 G.G. Umarjia S.A. Ketkarc S.W. Gosavib U.P. Mulika Dinesh Amalnerkar Journal on Material Science 2347–615X 1 1 25 77 Grain Growth, Composites, Electrical Properties, Microstructure-Final, Photopatternable Thick Films The review paper by Govind Umarji et.al furnishes state-of-the-art account of photopatternable thick film technology (with historical landmarks) and mainly focuses on materials, processing and formulation attributes of silver based conductor paste. In the subject comprehension, the authors have exclusively referred to their own R & D efforts in photopatternable thick film technology by investigating the effect of variation in weight percentage of glass on the overall performance of aqueous developable photoimageable silver composition which was previously optimized with respect to solid content of the polymer system. A glass weight % of ~3 to 5 is found to be ideal for the present photoimageable thick film formulation which beneficially offers pin-hole free microstructure, good adhesion due to vitreous bonding with the substrate, desired low sheet resistance and tolerable shrinkage in line/space pattern after firing. April - June 2013 Copyright © 2013 i-manager publications. All rights reserved. i-manager Publications http://www.imanagerpublications.com/Article.aspx?ArticleId=2282